SEMICON India 2026: From Chip Design To AI, How India Is Building A Semiconductor Ecosystem | Economy News
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SEMICON India 2026 showcases India’s growing semiconductor ecosystem, from RISC-V processors and AI chips to fabs, advanced packaging and chip design.
Prime Minister Narendra Modi addressed gathering at SEMICON India 2026 in New Delhi, on September 17.
SEMICON India 2026: India’s semiconductor push is expanding beyond chip design and fabrication, with companies, start-ups and research institutions increasingly building capabilities across advanced packaging, processor design, artificial intelligence, materials, equipment and high-performance computing.
The shift was visible at SEMICON India 2026, held at Yashobhoomi in New Delhi from September 17 to 19. The fifth edition of the event was organised around the theme ‘Silicon to Systems: Building the Ecosystem’ and brought together more than 600 exhibitors, including around 300 international companies, from across the semiconductor value chain. Representatives from 52 countries also participated.
The exhibition provided a snapshot of the capabilities being developed in India as the government seeks to build a semiconductor ecosystem covering design, manufacturing, packaging, equipment, materials, research and talent.
From chip design to computing systems
One of the key areas showcased at SEMICON India was the development of indigenous computing technologies. C-DAC showcased its work in high-performance computing and artificial intelligence, including the AUM HPC-AI Processor and the RUDRA-AUM compute node.
The focus reflects a broader effort to move beyond semiconductor design towards complete computing systems, including processors, accelerators and other technologies needed for AI and high-performance computing.
India’s semiconductor ecosystem is also seeing the development of application-specific chips and system solutions for sectors such as telecommunications, automotive, industrial applications and artificial intelligence.
RISC-V emerges as a key part of India’s processor push
Indigenous processor development was another prominent theme at the exhibition. C-DAC showcased its indigenous 64-bit RISC-V processor, based on the open RISC-V architecture. The processor is aimed at high-performance computing and emerging digital applications.
InCore Semiconductors showcased its RISC-V processor intellectual property and system-on-chip design automation tools. Its processor platforms are designed for different computing requirements, including embedded and edge-AI applications.
According to the government, InCore’s processor IP has been silicon-proven across multiple customer chips and technology nodes ranging from 180 nm to 16 nm.
The development of processor IP is important for India’s semiconductor ecosystem because it allows domestic companies to build chips and electronic systems around locally developed intellectual property.
Indigenous broadband technology
The exhibition also showcased how domestically developed semiconductor and processor technologies are being integrated into commercial applications. Aheesa Technology demonstrated an indigenous internet connectivity device capable of speeds of up to 1 Gbps. The device can enable Internet Service Providers to connect around 64 homes through a single Optical Line Terminal (OLT).
The system runs on Vihan, an India-developed software platform, and uses C-DAC’s 64-bit RISC-V processor. The example illustrates the effort to develop technology stacks that combine Indian-designed processors, software and connectivity solutions.
AI chips for surveillance, drones and robotics
The growing intersection between semiconductors and artificial intelligence was another focus at the exhibition. Indian semiconductor start-up Netrasemi showcased AI-capable system-on-chips for applications including surveillance, smart sensors, robotics, drones and mobility.
The company has taped out an indigenously designed AI SoC for CCTV surveillance using a 12 nm process node, integrating AI/ML accelerators, vision processing and video engines.
The development highlights the increasing role of specialised chips in edge-AI applications, where computing and data processing need to happen closer to the device rather than entirely in the cloud.
Chips for everyday applications
The exhibition also showcased semiconductor technologies designed for applications ranging from consumer appliances and electric mobility to energy management and industrial systems.
Vervesemi Microelectronics, for instance, is developing semiconductor solutions for motor control, energy meters and data acquisition. Its products are aimed at applications including consumer appliances, electric mobility and drones.
Such application-specific chips form an important part of the wider electronics manufacturing ecosystem because they connect semiconductor design with actual end-use products.
Semicon 2.0 expands India’s semiconductor ambition
The developments showcased at SEMICON India come as the government expands its semiconductor policy framework. The Union Cabinet approved Semicon 2.0 in July 2026 with an outlay of Rs 1,27,500 crore. The next phase is built around six broad areas: chip design, machines and materials, additional fabs, advanced packaging, research and development, and talent development.
The programme builds on Semicon 1.0, which focused on establishing the foundation for semiconductor manufacturing in India.
The government has said 12 semiconductor projects have been approved across six states, with investment commitments exceeding Rs 1.64 lakh crore. Three facilities have already started commercial production, according to the Ministry of Electronics and Information Technology.
Building a larger chip-design talent pool
India’s semiconductor strategy also places significant emphasis on developing the workforce required to support the industry. Under the Design Linked Incentive (DLI) Scheme, domestic chip-design projects have been supported across applications such as video surveillance, drone detection, energy meters, microprocessors, satellite communications, broadband and IoT system-on-chips.
The Chips to Startup (C2S) Programme is aimed at expanding semiconductor design capabilities among students, researchers, academic institutions and start-ups.
According to the government, more than one lakh engineers from over 500 organisations, including around 400 academic institutions and 100 start-ups, have been onboarded through the ChipIN Centre under the C2S Programme and DLI Scheme.
These participants have access to chip-design tools, fabrication services and specialised training. Together, they have developed more than 300 chip designs for fabrication at foundries in India and overseas, while recording more than four crore hours of chip-design tool usage.
From policy support to an emerging manufacturing ecosystem
SEMICON India 2026 also highlighted the widening scope of India’s semiconductor ambitions. The event brought together companies involved in chip design and intellectual property as well as fabs, packaging and testing, materials, equipment, electronics manufacturing, research and development and workforce development.
The government’s semiconductor strategy is therefore increasingly focused on building an ecosystem rather than only attracting individual chip manufacturing projects.
The event’s theme, ‘Silicon to Systems: Building the Ecosystem’, reflects that broader approach. As India seeks to strengthen its position in the global semiconductor supply chain, the challenge will be to connect domestic design capabilities with manufacturing, advanced packaging, equipment, materials, research and end-use electronics.
SEMICON India 2026 showcased how those pieces are beginning to come together — from RISC-V processors and AI chips to broadband systems, high-performance computing and semiconductor manufacturing.
The three-day event concluded with more than 51,000 registrations, cumulative footfall of around 40,000 and 56 MoUs, announcements and strategic initiatives, according to the government.
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Ask News18SEMICON India 2026 took place at Yashobhoomi in New Delhi from September 17 to 19, 2026. Organized around the theme ‘Silicon to Systems: Building the Ecosystem’, the fifth edition featured over 600 exhibitors from 52 countries, highlighting capabilities across chip design, advanced packaging, artificial intelligence, materials, equipment, and high-performance computing.
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